<rt id="kao22"><small id="kao22"></small></rt>
<acronym id="kao22"><div id="kao22"></div></acronym>
<sup id="kao22"></sup>
English
當前位置:首頁>設計與仿真>封裝設計>封裝疊層結構設計

Design Capability


Item

Package   Design

Electrical   Simulation

Thermal   Management

Mechanical   Analysis

1

FC/WB BGA Design

Impedance matching and   control

Thermal design and   verification

Process simulation (Molding, Reflow,   etc.)

2

MCM /SiP Design

Lumped parameter   elements extraction

Thermo-electrical co-simulation

Thermo-mechanical simulation (TC, HTS)

3

WLCSP / Fan out WLP   design

S parameters   extraction

Hot spot effect   evaluation

Humidity simulation

4

PoP/PiP design

TDR analysis

Thermal resistance   extraction

Hygro-mechanical simulation

5

FPC design

SI/PI analysis

 -

Thermo-mechanical-moisture simulation (HAST, 85°C/85RH, etc.)

6

2.5D Interposer Design

EMI analysis

 -

Drop test

7

Ceramic Design

IPD simulation

 -

 -

8

IPD Design

RF/MW System   simulation

 -

 -  


与两名人妻激情双飞