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中文
About Us
Leading the industrial development of advanced packaging technology
ABOUT
CASMEIT
The company's R&D team is composed of internationally renowned enterprises with R&D technology and management experience, leading talents of "mass entrepreneurship and innovation" in Jiangsu Province, and local R&D teams with rich R&D experience. The team members have rich experience in advanced semiconductor packaging field, such as fan-out, fan-in, chip flip, stacked packaging, silicon through-hole and other high-top fields. They have several independent intellectual property rights.
Was founded in
2018
Total surface area
30000square meters
Service Content
Integrated circuit advanced packaging, chip integration technology
Service
Packaging Technology Service
The company will combine the needs of the upstream and downstream industry chains to build into: advanced packaging technology research and development platform, advanced packaging industrialization base, talent training base, and become one of the world's well-known semiconductor packaging and testing companies
Design Capability
Electrical test, reliability test and failure analysis, thermal test platform
System Simulation
Electrical simulation, thermal management and thermomechanical reliability simulation, process simulation, etc.
SOLUTION
We provide multiple solutions for the electronics industry
SOLUTION
Wearble
IoT/Graphic Hub
Portable
Autonomous Sensing
Auto
Bumping
WLCSP
Plannar Fan-out
SiP
3D stacking
Communication Technology
HF RF, Radar sensor, ETC
Consumer market
Smart phone, HD memories, ETC
life sciences
Biosensors, Wearables, ETC
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